Black MPPO JEDEC Matrix Trays For IC Compartments With BGA Packing
Whether you're assembling, storing, or shipping ICs, our JEDEC trays provide reliable ESD protection and mechanical stability.
This JEDEC‑compliant matrix tray offers reliable protection and organization for your component workflow. Molded in a single piece from ESD‑safe polymer, it delivers consistent pocket spacing and minimal warpage over repeated use. Flat cell floors and integrated vacuum recesses ensure parts remain seated during handling, while chamfered corners and asymmetrical tabs provide instant orientation feedback. With its durable construction and inherent static‑dissipative properties, this tray supports both cleanroom operations and general assembly environments, maintaining part integrity from storage through placement.
Features & Benefits:
• Standardized Outline: Universally compatible with automated feeders, conveyor modules, and storage systems.
• Monolithic Construction: One‑piece molding eliminates weak points and ensures long service life with minimal maintenance.
• Static Control: Carbon‑enhanced resin uniformly dissipates charge without additional coatings or treatments.
• Automation‑Friendly: Precisely placed vacuum pickup points and alignment features reduce handling errors and setup times.
• Stack Stability: Interlocking side lips enable secure stacking of multiple trays, protecting components during storage and transit.
• Chemical & Temperature Resistance: Performs reliably in oven, wash‑process, and controlled‑environment applications.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN23057 | Cavity Size | 15.3*5.5*4.25mm |
| Package Type | IC Component | Matrix QTY | 7*14=98PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
Application:
Designed for diverse semiconductor and assembly processes, this tray excels at organizing parts for pick‑and‑place machines, test handlers, and inspection stations. Its robust material makeup permits exposure to cleaning solvents, bake‑out ovens, and humidity‑controlled areas. Commonly used in PCB assembly, IC test cells, and module manufacturing lines, it streamlines inventory handling and accelerates throughput by reducing part jostling and misfeeds.
Customization:
Enhance workflow efficiency with tailored tray options:
• Cell Profile Modification: Adjust pocket depths or add retention ribs to better secure non‑standard geometries.
• Color Coding: Select from a broad palette of ESD‑safe colorants for rapid visual sorting and process segregation.
• Molded Markers: Integrate raised codes or logos during molding for traceability without labels.
• Locating Features: Include additional tabs or key‑way slots to interface with proprietary automation or handling fixtures.
